According to Weibo, Realme announced that it will release the new X50 5G machine in Beijing on January 7. According to the information previously exposed, the new machine will use a dual-hole screen design and be equipped with a Snapdragon 765G chip, the X50 supports dual-mode 5G network and is equipped with VOOC flash charging 4.0 phones.
The Realme X50 has been confirmed to sport a hole-punch design with dual selfie cameras and will be powered by the Snapdragon 765G SoC. Also, it will be featured with a 120Htz display. It will come with a five-dimensional ice-cooled cooling technology that keeps your phone cool! The ice-cooled technology 8mm ultra-large diameter liquid-cooled copper tube, 410mm³ ultra-large volume; liquid-cooled copper tube heat dissipation 3.0; five-dimensional ice-cooled heat dissipation; 100% coverage of core heat sources.
The mobile will be equipped with VOOC flash charge 4.0, charging to 70% in 30 minutes. According to the official also said that it also has a full range of charging monitoring, which perfectly balances speed and safety.
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Realme X50 a five-dimensional ice-cooled cooling technology
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