NEWS

MediaTek Announces First Chip Built On 3nm Process Of TSMC

Finally, MediaTek and TSMC (Taiwan Semiconductor Manufacturing Company) have announced that the preceding has developed its first chip using the producer’s 3nm technology. The brand also revealed that it is expected to go about the mass production of the flagship Dimensity SoCs in the upcoming year, with the launch scheduled for the half of 2024.

The reports say as processors get smaller in dimensions, brands like MediaTek are already ready to cash in on it. However, the newest mechanization advancement for smartphone chips is the 3nm process. Meanwhile, presently, this process is available in the tiniest form, but the Korean brand Samsung is already industriously into production.   

In smartphones, 3nm Chips are efficient widely, changing within a year or two. Notably, the best to be had is a 4nm process, which is used in the manufacturing of the Snapdragon 8 Gen 1 and Gen 2. MediaTek officially revealed that the brand has successfully developed its first chip based on the 3nm process through TSMC. 

Moreover, TSMC has labeled this process N3, with its N5 being the earlier generation. If the rumors are to be believed, Apple may use TSMC’s 3nm manufacturing process for its upcoming generation of chips. For ongoing the Dimensity namesake, the latest 3nm chip will be used on a MediaTek Dimensity SoC.  

The chip is also expected to arrive with an 18% increase in speed and 32% power reduction. Whereas the logic density also increases by 60%. All of these schemes will lead to a higher rating of computations. The latest chip will bring improved and enhanced production process. 

Via

mediatek

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Aakash Gour

Aakash is the main editor of RM Update and coordinator of the news area. If it is important and urgent, Aakash has written about it. He is an expert in the Android and Google ecosystem. He has been writing about mobile phones and technology in RM Update since 2019, a time in which he has been debugging his analyses and especially product photography.

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